Our Dual Beam System features an electron beam column with fast blanking capabilities for lithography operations and a Ga ion-beam column for separate imaging and milling/patterning tasks. The system includes a gas injection system for Pt metal and SiO2 insulator deposition. The 'Slice and View' software facilitates the construction of 3D structural stacked images of focused ion-beam milled surfaces. Additionally, the Omniprobe system enhances TEM sample preparation. Equipped with a silicon drift detector, the system allows for rapid chemical analysis. It is also ideal for cross-sectional imaging of semiconductor devices and layered structures, electrical routing modification on semiconductor devices, failure analysis, and the preparation of specimens for physical-chemical analysis, transmission electron microscopy (TEM), AtomProbe analysis, micro-machining, and mask repair.

Classification:

• Services > Materials Characterisation > Electron Microscopy > Chemical Analysis > Energy-dispersive X-ray spectroscopy EDX / EDS Analysis
• Services > Materials Characterisation > Electron Microscopy > Chemical Analysis > Electron Backscatter Diffraction (EBSD)
• Services > Materials Characterisation > Electron Microscopy > TEM Sample Preparation / TEM Lift-Out
• Services > Materials Characterisation > Electron Microscopy > Cross-Section Sample Preparation / FIB Cross Section Imaging
• Services > Materials Characterisation > Electron Microscopy > Lithography